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product structure : silicon integrated circuit this product has no designed protection against radioactive rays . 1/ 37 tsz02201-0818abh00120-1-2 ? 2014 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 tsz22111 ? 14 ? 001 www.rohm.com 1ch gate driver providing galvanic isolation 2500vrms isolation voltage BM60055FV-C general description the BM60055FV-C is a gate driver with an isolation voltage of 2500vrms, i/o delay time of 250ns, minimum input pulse width of 1 70ns . it incorporates the fault signal output function (flt_uvlo, flt_sc, flt_ot), under voltage lockout (uvlo) function, short circuit protection (scp) function, over temperature protection (ot) function, over current protection ( oc ) function, soft turn off function, 2 level turn off function, active miller clamping function, switching controller function and output state feedback function. features ? fault signal output function ? under voltage lockout function ? short circuit protection function ? over current protection function ? over temperature protection ? temperature compensation of oc ? soft turn off function of scp ? 2 level turn off function ? active miller clamping ? switching controller ? output state feedback function ? aec -q100 qualified (note 1) ( note 1 :grade1) applications ? automotive isolated igbt/mosfet inverter gate drive. ? automotive dc-dc converter. ? industrial inverters system. ? ups system. key specifications ? isolation voltage: 2500 [vrms] (max) ? maximum gate drive voltage: 24 [v] (max) ? i/o delay time: 250 [ns] (max) ? minimum input pulse width: 170 [ns] (max) package w(typ) x d(typ) x h(max) ssop-b28w 9.2mm x 10.4mm x 2.4mm typical application circuit q s r + + dac slope - + osc osc regulator uvlo_batt max.duty t imer t imer - osc rese t osc t imer q s r flt logic osfb current source - + - + t emp compensation filter - + filter 2 level t urn off contol - + - + pre driver logic - + vcc2 gnd1 flt_uvlo inb ina osfb fb comp v_batt vreg fet_g sense gnd1 v_ba tt gnd1 flt_ot flt_sc ecu vcc2 gnd2 out2 rtoff scpin ocin uvloin gnd2 gnd2 filter filter lvoff to tc vcc2 proout out1 rectifier / ripple f ilter rectifier / ripple f ilter snubber gnd2 gnd1 tcomp figure 1. typical application circuit datashee t downloaded from: http:///
2/ 37 BM60055FV-C tsz02201-0818abh00120-1-2 ? 2014 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 contents general description ........................................................................................................................................................................ 1 features .......................................................................................................................................................................................... 1 applications .................................................................................................................................................................................... 1 key specifications .......................................................................................................................................................................... 1 package w(typ) x d(typ) x h(max) ....................................................................................................................... 1 typical application circuit ............................................................................................................................................................... 1 contents ......................................................................................................................................................................................... 2 recommended range of external constants pin configuration ......................................................................................... 3 pin descriptions .............................................................................................................................................................................. 3 thermal resistance (note6) ................................................................................................................................................................ 5 recommended operating conditions (ta= -40c to +125c) ........................................................................................................ 5 electrical characteristics ................................................................................................................................................................ . 6 (unless otherwise specified ta=-40c to125c, v batt =4.5v to 30v, v cc2 =9v to 24v) ................................................................... 6 typical performance curves ........................................................................................................................................................... 9 figure 3. main power supply circuit current 1 ........................................................................................................................... 9 figure 4. main power supply circuit current 2 ........................................................................................................................... 9 figure 5. output side circuit current .......................................................................................................................................... 9 figure 6. fet_g on-resistance ................................................................................................................................................ 9 figure 7. soft-start time ............................................................................................................................................................ 10 figure 9. comp pin sink current ............................................................................................................................................. 10 figure 10. comp pin source current ....................................................................................................................................... 10 figure 11. over-current detection threshold ............................................................................................................................ 11 figure 12. logic input filtering time ......................................................................................................................................... 11 figure 13. out1 source on-resistance .................................................................................................................................. 11 figure 14. out1 sink on-resistance ...................................................................................................................................... 11 figure 15. proout on-resistance ......................................................................................................................................... 12 figure 16. turn on time ............................................................................................................................................................ 12 figure 17. turn off time .......................................................................................................................................................... 12 figure 18. out2 on resistance .............................................................................................................................................. 12 figure 19. over current detection voltage ............................................................................................................................... 13 figure 20. short circuit detection voltage ................................................................................................................................ 13 figure 21. over temperature detection voltage ....................................................................................................................... 13 description of functions and examples of constant setting ........................................................................................................ 16 selection of components externally connected ........................................................................................................................... 28 i/o equivalent circuit .................................................................................................................................................................... 29 operational notes ......................................................................................................................................................................... 33 1. reverse connection of power supply ............................................................................................................................ 33 2. power supply lines ........................................................................................................................................................ 33 3. ground voltage ............................................................................................................................................................... 33 4. ground wiring pattern .................................................................................................................................................... 33 5. thermal consideration ................................................................................................................................................... 33 6. recommended operating conditions ............................................................................................................................. 33 7. inrush current ................................................................................................................................................................ . 33 8. operation under strong electromagnetic field .............................................................................................................. 33 9. testing on application boards ......................................................................................................................................... 33 10. inter-pin short and mounting errors ............................................................................................................................... 33 11. unused input pins .......................................................................................................................................................... 34 12. regarding the input pin of the ic ................................................................................................................................... 34 13. ceramic capacitor .......................................................................................................................................................... 34 ordering information ..................................................................................................................................................................... 35 marking diagrams ......................................................................................................................................................................... 35 physical dimension , tape and reel information ........................................................................................................................... 36 revision history ............................................................................................................................................................................ 37 downloaded from: http:///
3/ 37 BM60055FV-C tsz02201-0818abh00120-1-2 ? 2014 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 recommended range of external constants pin configuration pin name symbol recommended value unit min typ max tc r tc 1.25 - 50 k rt off r rtoff 4.6 10 30 k vbatt c vbatt 3 - - f vcc2 c vcc2 0.4 - - f vreg c vreg 0.1 1 10 f pin descriptions pin no. pin name function 1 gnd2 output-side ground pin 2 uvloin output-side uvlo setting pin 3 ocin over current detection pin 4 scpin short circuit detection pin 5 lvoff 2-level turn off level setting pin 6 rtoff 2-level turn off time setting pin 7 tcomp temp compensation pin of oc 8 to constant current output pin / over temperature detection pin 9 tc constant current setting resistor connection pin 10 proout soft turn-off pin 11 vcc2 output-side power supply pin 12 out1 output pin 13 out2 input and output pin for miller clamp / gate voltage input pin 14 gnd2 output-side ground pin 15 gnd1 input-side ground pin 16 flt_uvlo fault (uvlo) output pin 17 inb control input pin b 18 ina control input pin a 19 osfb output state feedback output pin 20 flt_ot fault (ot) output pin 21 flt_sc fault (scp) output pin 22 fb error amplifier inverting input pin for switching controller 23 comp error amplifier output pin for switching controller 24 v_batt main power supply pin 25 vreg power supply pin for driving mos fet for switching controller 26 fet_g mos fet control pin for switching controller 27 sense current feedback resistor connection pin for switching controller 28 gnd1 input-side ground pin figure 2. pin configuration flt_sc flt_ot 20 osfb 21 19 9 ina 18 inb 17 flt_uvlo 16 gnd1 28 sense 27 fet_g 26 vreg 25 v_batt 24 comp 23 fb 22 to 8 9 10 vcc2 11 out1 12 out2 13 gnd1 gnd2 1 uvloin 2 ocin 3 scpin 4 lvoff 5 rtoff 6 tcomp 7 tc proout 15 gnd2 14 downloaded from: http:///
4/ 37 BM60055FV-C tsz02201-0818abh00120-1-2 ? 2014 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 absolute maximum ratings (note 2) relative to gnd1 (note 3) relative to gnd2 (note 4) should not exceed pd and tj=150 ? c (note 5) derate above ta=25 ? c at a rate of 9.0mw/ ? c. mounted on a glass epoxy of 114.3 mm ? 76.2 mm ? 1.6 mm. caution : operating the ic over the absolute maximum ratings may damage the ic. the damag e can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. parameter symbol rating unit main power supply voltage v battmax -0.3 to+40.0 (note 2) v output-side supply voltage v cc2max -0.3 to +30.0 (note 3) v ina, inb pin input voltage v inmax -0.3 to 7.0 (note 2) v flt_uvlo pin, flt_sc pin, flt_ot pin, osfb pin input voltage v fltmax -0.3 to +7.0 (note 2) v flt_uvlo pin, flt_sc pin, flt_ot pin, osfb pin output current i flt 10 ma fb pin input voltage v fbmax -0.3 to +7.0 (note 2) v fet_g pin output current (peak5s) i fet_gpeak 1000 ma scpin pin, ocin pin input voltage v scpinmax, v ocinmax -0.3 to +6.0 (note 3) v uvloin pin input voltage v uvloinmax -0.3 to v cc2 +0.3 (note 3) v lvoff pin input voltage v lvoffinmax -0.3 to v cc2 +0.3 (note 3) v tcomp pin input voltage v tcompinmax -0.3 to v cc2 +0.3 (note 3) v to pin input voltage v tomax -0.3 to v cc2 +0.3 (note 3) v to pin output current i tomax 8 ma out1 pin output current (peak 5 s ) i out1peak 5000 (note 4) ma out2 pin output current (peak 5 s ) i out2peak 5000 (note 4) ma proout pin output current (peak 30 s ) i prooutpeak10 2000 (note 4) ma power dissipation pd 1.12 (note 5) w operating temperature range topr -40 to +125 c storage temperature range tstg -55 to +150 c junction temperature tjmax +150 c downloaded from: http:///
5/ 37 BM60055FV-C tsz02201-0818abh00120-1-2 ? 2014 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 thermal resistance ( note 6) parameter symbol thermal resistance (typ) unit 1s (note 8) 2s2p ( note 9) to252-j5 / to252-3 junction to ambient ja 112.9 64.4 c /w junction to top characterization parameter (note 7) jt 34 23 c /w (note 6) based on jesd51-2a(still-air) (note 7) the thermal characterization parameter to report the difference between junction tem perature and the temperature at the top center of the outside surface of the component package. (note 8) using a pcb board based on jesd51- 3. (note 9) using a pcb board based on jesd51- 7. layer number of measurement board material board size single fr -4 114.3mm x 76.2mm x 1.57mmt top copper pattern thickness footprints and traces 70 m layer number of measurement board material board size 4 layers fr -4 114.3mm x 76.2mm x 1.6mmt top 2 internal layers bottom copper pattern thickness copper pattern thickness copper pattern thickness footprints and traces 70 m 74.2mm 2 (square) 35 m 74.2mm 2 (square) 70 m recommended operating conditions (ta= -40c to +125c) parameter symbol min max units main power supply voltage v batt (note 10 ) 4.5 30.0 v output-side supply voltage v cc2 (note 11 ) 9 24 v output side uvlo voltage v uv2th (note11) 6 - v (note 10 ) gnd1 reference (note 11 ) gnd2 reference insulation related characteristics parameter symbol characteristic unit insulation resistance (v io =500v) r s >10 9 insulation withstand voltage / 1min v iso 2500 vrms insulation test voltage / 1sec v iso 3000 vrms downloaded from: http:///
6/ 37 BM60055FV-C tsz02201-0818abh00120-1-2 ? 2014 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 electrical characteristics (unless otherwise specified ta=-40c to125c, v batt =4.5v to 30 v, v cc2 =9v to 24v) parameter symbol min typ max unit conditions general main power supply circuit current 1 i batt1 0. 5 1. 3 2. 2 ma fet_g pin switching operat ion main power supply circuit current 2 i batt2 0. 4 1. 2 2.1 ma fet_g pin no switching output side circuit current i cc2 1.8 3.2 4.8 ma r tc =10k switching power supply controller fet_g output voltage h1 v fetgh1 4.5 5.0 5.5 v i out =0a(open) fet_g output voltage h2 v fetgh2 4.0 4.5 - v v_batt=4.5v i out =0a(open) fet_g output voltage l v fetgl 0 - 0.3 v i out =0a(open) fet_g on -resistance (source-side) r ongh 3 6 12 10ma fet_g on-resistance (sink-side) r ongl 0.3 0.6 1.3 10ma oscillation frequency f osc_sw 80 100 120 khz soft-start time t ss - - 50 ms fb pin threshold voltage v fb 1.47 1.50 1.53 v fb pin input current i fb -0.8 0 +0.8 a comp pin sink current i compsink - 160 - 80 - 40 a comp pin source current i compsource 40 80 160 a over voltage detection threshold v ovth 1.60 1.65 1.70 v under voltage detection threshold v uvth 1.23 1.30 1.37 v over-current detection threshold v octh 0.17 0.20 0.23 v v_batt uvlo off voltage v uvlobatth 4.05 4.25 4.45 v v_batt uvlo on voltage v uvlobattl 3.95 4.15 4.35 v maximum on duty d onmax 75 85 95 % protection holding time t dcdcrls 20 40 60 ms logic block logic high level input voltage v inh 3.5 - - v ina inb logic low level input voltage v inl - - 1.5 v ina inb logic pull-down resistance r ind 25 50 100 k ina inb logic input filtering time t infil 70 120 170 ns ina inb output out1 on-resistance (source-side) r onh 0.25 0.60 1.35 i out =40ma out1 on-resistance (sink-side) r onl 0.05 0.40 1.15 i out =40ma out1 maximum current i outmax 5.0 - - a v cc2 =15v guaranteed by design proout on-resistance r onpro 0.35 0.70 1.45 i proout =40ma turn on time t pon 130 190 250 ns turn off time t poff 130 190 250 ns propagation distortion t pdist - 60 0 +60 ns t poff - t pon downloaded from: http:///
7/ 37 BM60055FV-C tsz02201-0818abh00120-1-2 ? 2014 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 electrical characteristics - continued (unless otherwise specified ta=-40c to125c, v batt =4.5v to 30 v, v cc2 =9 v to 24v) parameter symbol min typ max unit conditions rise time t rise - 30 50 ns load=1nf fall time t fall - 30 50 ns load=1nf out2 on-resistance r on2 0.1 0.45 1.2 i out =40ma out2 on threshold voltage v out2on 2.7 3 .0 3.3 v common mode transient immunity cm 100 - - kv/s design assurance protection functions output-side uvlo off threshold voltage v uvlo2h 0.95 1.00 1.05 v output-side uvlo on threshold voltage v uvlo2l 0.85 0.90 0.95 v output-side uvlo filtering time t uvlo2fil 1.5 2.0 2.5 s output-side uvlo delay time (out) t duvlo2out 1. 5 2. 2 2. 9 s output-side uvlo delay time (flt_uvlo) t duvlo2flt 1.5 - 65 s over current detection voltage1 v oc det 0.6 58 0.700 0.7 42 v tcomp=vcc2 over current detection voltage2 v oc det 0.394 0.420 0.441 v to=4v tcomp=gnd2 over current detection voltage3 v oc det 0.6 58 0.700 0. 7 42 v to=3v tcomp=gnd2 over current detection voltage4 v oc det 0.8 74 0.930 0.9 86 v to=2.2v tcomp=gnd2 over current detection filtering ti me t d oc fil 0.70 1.00 1.30 s over current detection delay time (out) v d oc out 0.73 1.03 1.33 s out1=30k pull down over current detection delay time (prout) v d oc prout 0.73 1.03 1.33 s proout=30k pull up over current detection delay time (flt_sc) v d oc flt_sc 0.75 1.05 1.35 s short circuit detection voltage v s cp det 0.95 1.00 1.05 v short circuit detection filtering time t scpfil 0.10 0.20 0.30 s short circuit detection delay time (out) t dscpout 0.17 0.23 0.38 s out1=30k pull down short circuit detection delay time (proout) t dscpproout 0.19 0.25 0.40 s proout=30k pull up short circuit detection delay time (flt_sc) t dscpflt_sc 0.23 0.29 0.44 s tc pin voltage v tc 0.975 1.000 1.025 v to pin output current i to 0.97 1.00 1.03 ma r tc =10k to pin disconnect detection voltage v toh 7 8 9 v downloaded from: http:///
8/ 37 BM60055FV-C tsz02201-0818abh00120-1-2 ? 2014 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 electrical characteristics - continued (unless otherwise specified ta=-40c to125c, v batt =4.5v to 30 v, v cc2 =9v to 24v) parameter symbol min typ max unit conditions over temperature detection voltage(on) v otdeton 1.96 2.0 2.04 v over temperature detection voltage(off) v otdetoff 2.15 2.2 2.25 v over temperature detection delay time (out) t dotout 2 10 30 s out1=30k pull down over temperature detection delay time (flt_ot) t dotflt 1 - 35 s flt_uvlo, flt_sc, flt_ot, on -resistance r onflt - 30 80 i flt =5ma fault (uvlo) output holding time t uvlo_fltrls 20 40 60 ms fault (scp) output holding time t scp_fltrls 20 40 60 ms 2-level turn off voltage offset 1 v lvoff1 - 300 - 150 0 mv vcc2=15v, lvoff=12v 2-level turn off voltage offset 2 v lvoff2 - 35 0 - 20 0 -50 mv vcc2=15v, lvoff=8v 2-level turn off enable threshold voltage v lvoffth 0.7 1.0 1.3 v 2-level turn off time t rtoff 1.93 2. 3 2.67 s r rtoff = 16 k gate state h detection threshold voltage v osfbh 4.5 5.0 5.5 v gate state l detection threshold voltage v osfbl 4.0 4.5 5.0 v osfb output on-resistance r osfb - 30 80 i osfb =5ma downloaded from: http:///
9/ 37 BM60055FV-C tsz02201-0818abh00120-1-2 ? 2014 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves figure 3 . main power supply circuit current 1 (fet_g pin switching operati on ) figure 4 . main power supply c ir cuit current 2 (fet_g pin no switching) figure 5 . output side circuit current (r tc =10k ) figure 6 . fet_g on-resistance (10ma) 1.8 2.3 2.8 3.3 3.8 4.3 4.8 9 14 19 24 i cc2 [ma] v cc2 [v] 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 5 15 25 i batt [ma] v batt [v] 0.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9 2.1 5 15 25 i batt [ma] v batt [v] 0 2 4 6 8 10 - 40 0 40 80 120 r ongh /r ongl [] ta[ ] - 40 25 125 - 40 25 125 - 40 25 125 sink side source side downloaded from: http:///
10 / 37 BM60055FV-C tsz02201-0818abh00120-1-2 ? 2014 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves C continued figure 7 . soft-start time figure 8 . fb pin threshold voltage figure 9 . comp pin sink current figure 10 . comp pin source current 0 10 20 30 40 50 - 40 0 40 80 120 t ss [ms] ta[ ] 1.47 1.48 1.49 1.50 1.51 1.52 1.53 - 40 0 40 80 120 v fb [v] ta[ ] - 160 - 140 - 120 - 100 - 80 - 60 - 40 - 40 0 40 80 120 i compsink [ a] ta[ ] 40 60 80 100 120 140 160 - 40 0 40 80 120 i compsource [ a ] ta[ ] downloaded from: http:///
11 / 37 BM60055FV-C tsz02201-0818abh00120-1-2 ? 2014 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued figure 11 . over-current detection threshold figure 12 . logic input filtering time (ina,inb) figure 13 . out1 source on-resistance (i out =40ma) figure 14 . out1 sink on-resistance (i out =40ma) 0.17 0.19 0.21 0.23 - 40 0 40 80 120 v octh [v] ta[ ] 70 80 90 100 110 120 130 140 150 160 170 - 40 0 40 80 120 t infil [ns] ta[ ] 0.25 0.45 0.65 0.85 1.05 1.25 - 40 0 40 80 120 r onh [] ta[ ] 0.05 0.25 0.45 0.65 0.85 1.05 - 40 0 40 80 120 r onh [] ta[ ] ina off pulse inb off pulse ina on pulse inb on pulse downloaded from: http:///
12 / 37 BM60055FV-C tsz02201-0818abh00120-1-2 ? 2014 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued figure 15 . proout on-resistance (i proout =40ma) figure 16 . turn on time figure 17 . turn off time figure 18 . out2 on resistance (i out =40ma) 130 150 170 190 210 230 250 - 40 0 40 80 120 t pona [v] ta[ ] 130 150 170 190 210 230 250 - 40 0 40 80 120 t pona [v] ta[ ] 0.35 0.63 0.90 1.18 1.45 - 40 0 40 80 120 r onpro [] ta[ ] 0.1 0.3 0.5 0.7 0.9 1.1 - 40 0 40 80 120 r on2 [] ta[ ] downloaded from: http:///
13 / 37 BM60055FV-C tsz02201-0818abh00120-1-2 ? 2014 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued figure 19 . over current detection voltage figure 20 . short circuit detection voltage figure 21. over temperature detection voltage 0.4 0.5 0.6 0.7 0.8 0.9 - 40 0 40 80 120 v ocdet [v] ta[ ] 0.95 0.96 0.97 0.98 0.99 1.00 1.01 1.02 1.03 1.04 1.05 - 40 0 40 80 120 v scpdet [v] ta[ ] 1.96 2.01 2.06 2.11 2.16 2.21 - 40 0 40 80 120 v otdet [v] ta[ ] off voltage on voltage t o= 4v (tcomp=gnd2) to=2.2v (tcomp=gnd2) tcomp=vcc2 t o= 3v (tcomp=gnd2) downloaded from: http:///
14 / 37 BM60055FV-C tsz02201-0818abh00120-1-2 ? 2014 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 description of pins and cautions on layout of board 1. v_batt (main power supply pin) this is the main power supply pin. connect a bypass capacitor between v_batt and gnd1 in order to suppress voltage variations. make sure that power is supplied even when the switching power supply is not used, since the internal reference voltage of the input side of chip is generated from this power supply. 2. gnd1 (input-side ground pin) the gnd1 pin is a ground pin for the input sid e. 3. gnd2 (output-side ground pin) the gnd2 pin is a ground pin for the output side. connect gnd2 pin to the emitter / source of the output device. 4. ina, inb (control input pin a, control input pin b) they are pins for determining the output logic. inb ina out1 h l l h h l l l l l h h 5. flt_uvlo, flt_sc, flt_ot (fault output pins) these pins have open drains that output fault signals when faults occur (i.e., when the under voltage lockout function (uvlo) or short circuit protection function (scp) or over current protection function (oc) or over temperature protection (ot) is activated). state flt_uvlo flt_sc flt_ot while in normal operation hi -z hi -z hi -z v_batt uvlo or vcc2 uvlo or to pin open l hi -z hi -z scp or oc hi -z l hi -z ot hi -z hi -z l 6. osfb (output pin for monitoring gate condition) this is an open drain pin which outputs the state of gate logic of the output element monitored with out2 pin. out2(input) osfb h hi - z l l 7. fb (error amplifier inverting input pin for switching controller) this is a voltage feedback pin of the switching controller. this pin combine with voltage monitoring at over voltage protection function and under voltage protection function for switching controller. when over voltage or under voltage protection is activated, switching controller will be at off state (fet_g pin outputs low). when the protection holding time (t dcdcrls ) is completed, the protection function will be released. under voltage function is not activated during soft-start. 8. comp (error amplifier output pin for switching controller) this is the gain control pin of the switching controller. connect a phase compensation capacitor and resistor. when the switching controller is not used, connect it to gnd1. 9. vreg (power supply pin for the driving mos fet of the switching controller) this is the power supply pin for the driving mosfet of the switching controller transformer drive. be sure to connect a capacitor between vreg and gnd1 even when the switching controller is not used, in order to prevent oscillation and to suppress voltage variation due to fet_g output current. downloaded from: http:///
15 / 37 BM60055FV-C tsz02201-0818abh00120-1-2 ? 2014 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 description of pins and cautions on layout of board C continued 10. fet_g (mos fet control pin for switching controller) this is a mosfet control pin for the switching controller transformer drive. leave it open when the switching controller is not used. 11. sense (connection to the current feedback resistor of the switching controller) this is a pin connected to the resistor of the switching controller current feedback. fet_g pin output duty is controlled by the voltage value of this pin. this pin combines with current monitoring at over current protection function for switching controller. when over current protection is activated, switching controller will be at off state (fet_g pin outputs low). when the protection holding time (t dcdcrls ) is completed, the over current function will be released. 12. out1(output pin) the out1 pin is a gate driving pin. 13. out2 (miller clamp pin) th e out2 pin is for preventing the increase in gate voltage due to the miller current of the power device connected to th e out pin. it also functions as a pin for monitoring gate voltage for for miller clamp function and output state feedback function. if both functions are not used, short-circuit the out2 pin to the gnd2 pin. 14. proout (soft turn-off pin) this pin is for soft turn-off of output pin when short-circuit protection or over current protection is in action. 15. scpin (short circuit current detection pin) this pin is used to detect current for short circuit protection. when the scpin voltage exceeds the voltage set with the v scpdet parameter, the scp function will be activated, this will make the ic function in an open state. to avoid such trouble, connect a resistor between the scpin and the gnd2 or short the scpin pin to gnd2 when the scp function is not used. 16. oc in (over current detection pin) this pin is used to detect current for over current protection. when the oc in voltage exceeds the voltage set with the v oc det parameter, the oc function will be activated, this will make the ic function in an open state. to avoid such trouble, connect a resistor between the oc in and the gnd2 or short the oc in pin to gnd2 when th e oc function is not used. 17. tcomp (temperature compensation pin) this pin is for temperature compensation of over current detection. if the function is used, connect tcomp to gnd 2. if the function is not used, connect tcomp to vcc2. 18. lvoff (2-level turn off level setting pin) the lvoff pin is a pin used to make setting of 2-level turn off time. the voltage of lvoff pin is 2-level turn off level. when the v lvoff > v lvoffth, 2-level turn off function is activated 19. rtoff (2-level turn off time setting pin) the rtoff pin is a pin used to make the setting of 2-level turn off time. connect a resistor r rt between rtoff and the gnd2 pin. 20. tc (resistor connection pin for setting constant current source output) the tc pin is a resistor connection pin for setting the constant current output. if an arbitrary resistance value is connected between tc and gnd2, it is possible to set the constant current value output from to. 21. to (constant current output / sensor voltage input pin) the to pin is constant current output / voltage input pin. it can be used as a temperature protection input by connecting an element with arbitrary impedance between to pin and gnd. furthermore, the to pin disconnect detection function is built -in. 22. uvloin (output-side uvlo setting input pin) the uvloin pin is a pin for deciding uvlo setting value of vcc2. the threshold value of uvlo can be set by dividing the resistance voltage of vcc2 and inputting such value. downloaded from: http:///
16 / 37 BM60055FV-C tsz02201-0818abh00120-1-2 ? 2014 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 description of functions and examples of constant setting 1. fault status output this function is used to output a fault signal from the flt_uvlo pin when the under voltage lockout function (uvlo) is activated, the flt_sc pin when the short circuit protection function (scp) or over current protection (oc) is activated, and the flt_ot pin when the over temperature protection (ot) is activated. the functions of uvlo and scp/oc is to hold the fault signal until fault output holding time (t uvlo_fltrls, t scp_fltrls, ) is completed. status flt_uvlo pin normal hi -z uvlo l status flt_sc pin normal hi -z scp , oc l the ot function holds the fault signal until to pin voltage goes high above v todetoff. status flt_ot pin normal hi -z ot l when uvlo function is activated during scp or oc, the fault output holding time occurs after uvlo cancellation. fault output holding time (t uvlo_fltrls ) scp or oc status fault occurs (scp or oc) uvlo status flt_sc hi -z l fault occurs (uvlo) flt_uvlo hi -z l figure 24. fault status output timing chart (scp/oc and uvlo) figure 23. fault status output timing chart (ot) flt_ ot hi -z l figure 22. fault status output timing chart (scp/oc,uvlo) flt_uvlo flt_sc hi -z l status fault occurs (ot) fault occurs (uvlo or scp or oc) status 35us downloaded from: http:///
17 / 37 BM60055FV-C tsz02201-0818abh00120-1-2 ? 2014 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 2. under voltage lockout (uvlo ) function bm60055 fv -c incorporates the under voltage lockout (uvlo) function on v_batt and vcc2. when the power supply voltage drops to the uvlo on voltage, out1 turns off and the flt_uvlo pin will both output the l signal. when the power supply voltage rises to the uvlo off voltage, these pins will be reset. however, during the fau lt output holding time set in fault status output section, the out pin and the flt_uvlo pin will hold the l signal. in addition, to prevent mis-trigger ing due to noise, mask time t uvlo2fil are set on both low and high voltage sides. ina h v_batt l v uvlobatth v uvlobattl flt hi -z l out1 h l fet_g h l ina h uvloin l v uvlo2h v uvlo2l flt hi -z l out1 h l fet_g h l when v lvoff < v lvoffth, normal turn off is activated. figure 25. v_batt uvlo function operation timing chart figure 26. vcc2 uvlo function operation timing chart flt_uvlo flt_uvlo ? figure 27. uvlo operation timing chart (normal turn off) flt_uvlo proout v_batt uvloin out1 gate voltage in hi -z l hi -z l v uvlobattl /v uvlo2l l hi -z h h l fault output holding time out2 hi -z l v out2on l v uvlobatth /v uvlo2h t uvlobatth t uvlo2fil v lvoff l v lvoff th t uvlobatth t uvlo2fil downloaded from: http:///
18 / 37 BM60055FV-C tsz02201-0818abh00120-1-2 ? 2014 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 when v lvoff > v lvoffth, 2-level turn off is activated. v lvoff description of functions and examples of constant setting - continued 3. short circuit protection (scp) function when the scpin pin voltage exceeds a voltage set with the v scpdet parameter, the scp function will be activated. when the scp function is activated, soft turn off is activated. when the scp function is activated, out pin voltage will be set to the hi - z level and the proout pin voltage will be set to l level first. next, out2 pin voltage < v out2on , internal mos of out2 pin is turned on (miller clamping) and out1 will become l. h ? figure 29. scp operation timing chart fault output holding time flt_sc proout scpin out1 gate voltage in hi -z l hi -z l v scdet l hi -z h h l fault output holding time out2 hi -z l v out2on l ? figure 28. uvlo operation timing chart (2 level turn off) flt_uvlo proout v_batt uvloin out1 gate voltage in hi -z l hi -z l v uvlobattl /v uvlo2l l v lvoff h l fault output holding time h out2 hi -z l l v uvlobatth /v uvlo2h t uvlobatth t uvlo2fil t scpfil t scpfil t on or t on + t rtoff v lvoffth v lvoff v out2on t on o r t on + t rtoff t on or t on + t rtoff t uvlobatth t uvlo2fil downloaded from: http:///
19 / 37 BM60055FV-C tsz02201-0818abh00120-1-2 ? 2014 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 4. over current protection (oc ) function when the oc in pin voltage exceeds a voltage set with the v oc det parameter, the oc function will be activated. when the oc function is activated, soft turn off is activated. when the oc function is activated, out pin voltage will be set to the hi - z level and the proout pin voltage will be set to l level first. next, out2 pin voltage < v out2on , internal mos of out2 pin is turned on (miller clamping) and out1 will become l. ? figure 30 . oc operation timing chart fault output holding time flt_sc proout ocin out1 gate voltage in hi -z l hi -z l v ocdet l hi -z h h l fault output holding time out2 hi -z l v out2on l t asfil t asfil t on or t on + t rtoff t on or t on + t rtoff t on or t on + t rtoff downloaded from: http:///
20 / 37 BM60055FV-C tsz02201-0818abh00120-1-2 ? 2014 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 description of functions and examples of constant setting - continued 5. 2-level turn off when v lvoff > v lvoffth, 2-level turn off is activated. 2-level turn off time t rtoff and voltage level v lvoff is adjustable by external elements of rtoff pin and lvoff pin. the values of the 2-level turn off level v lvoff is determined by the values of the voltage of lvoff pin. the values of the 2-level turn off time t rtoff is determined by the values of the resistor r rt according to the following formula (typical values): [ ] 05 .0+ 145 .0= k r t rt rtoff [us] the propagation delay time (on) of the out1 is delayed for the same time as the 2-level turn off time t rtoff. when v lvoff < v lvoffth , turn on time does not include 2-level turn off time and normal turn off is activated. figure 31. 2 level turn off function block diagram out1 timer rtoff r rt vcc2 gnd2 lvoff gate on/off 3 state buffer + - in out1 h figure 32. timing chart of turn off proout gate voltage t o ff h l v lvoff l l h v lvoff l v out2on t rtoff t on l h v lvoffth v lvoff t on t rtoff t on downloaded from: http:///
21 / 37 BM60055FV-C tsz02201-0818abh00120-1-2 ? 2014 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 6. temperature compensation of oc when tcomp = gnd2, temperature compensation of oc is activated . if the function is not used, connect tcomp to vcc2. tcomp=gnd2 the temperature of oc detection voltage can be compensated in accordance with to voltage. 552 .1+ 283 .0 = to oc v v [v] tcomp=vcc2 7.0 = oc v [v] downloaded from: http:///
22 / 37 BM60055FV-C tsz02201-0818abh00120-1-2 ? 2014 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 description of functions and examples of constant setting - continued 7. miller clamping when out1=l and out2 pin voltage < v out2on , internal mos of out2 pin is turned on, and miller clamp function operates. figure 33. block diagram of miller clamp function figure 34. timing chart of miller clamp function in out2 pin input voltage out2 l not more than v out2on l h x hi -z in a scpin flt_sc out1 out2 (input) proout t on t fltrls h l v scdet hi -z l l v out2on hi -z h h l v out2on out2 logic out1 vcc2 gnd2 - + predriv er predriv er predriv er out2 (out put) hi -z l downloaded from: http:///
23 / 37 BM60055FV-C tsz02201-0818abh00120-1-2 ? 2014 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 description of functions and examples of constant setting - continued 8. over temperature protection function constant current is supplied from to pin from the built-in constant current circuit. this current value can be adjusted in accordance with the resistance value connected between tc and gnd2. furthermore, to pin has voltage inpu t function, and when the to pin voltage < v otdet on, out1 turns off and flt_ot becomes l. when the to pin voltage goes high above v otdetoff , the ot function will be released. tc tc r 10 v ? ? r tc to vcc2 tc z gnd2 flt_ot 10 filter figure 35. block diagram of temperature monitor function when v lvoff < v lvoffth, normal turn off is activated. v lvoff constant current value ? h to in out1 hi -z l h l out2 hi -z l proout l v ot de t on l flt_ot hi -z l gate voltage v out2on t otfil l v lvoffth figure 36. ot operation timing chart (normal turn off) v otdetoff ~ 35us t otfil downloaded from: http:///
24 / 37 BM60055FV-C tsz02201-0818abh00120-1-2 ? 2014 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 description of functions and examples of constant setting C continued when v lvoff > v lvoffth, 2-level turn off is activated. v lvoff 9. switching controller (1) basic action this ic has a built-in switching power supply controller which repeats on/off synchronizing with internal clock. when v_batt voltage is supplied (v_batt > v uvlobatth ), fet_g pin starts switching by soft-start. output voltage is determined by the following equation by external resistance and winding ratio n of flyback transformer (n= v out2 side winding number/v out1 side winding number) ? ? ? ? ? ? vn r/ r r v v 2 2 1 fb 2out ? ? ? ? (2) max duty when, for example, output load is large, and voltage level of sense pin does not reach current detection level, o utput is forcibly turned off by maximum on duty (d onmax ). (3) pinconditions when the switching power supply controller is not used implement pin connection as shown below when switching power supply is not used. pin number pin name treatment method 22 fb connect to vreg 23 comp connect to gnd1 24 v_batt connect power supply 25 vreg connect capacitor 26 fet_g no connection 27 sense connect to gnd1 10. output state feedback function when gate logic of output device monitored with out2 pin is h, a logic h is the output from osfb pin. when out2 pin is l, a logic l is the output from osfb pin. ? to in out1 out2 proout flt_ot gate voltage t otfil figure 37. ot operation timing chart (2 level turn off) h l v lvoffth l v otdet on v otdetoff h hi -z l hi -z l l l hi -z l v out2on v lvoffth ~ 35us t otfil downloaded from: http:///
25 / 37 BM60055FV-C tsz02201-0818abh00120-1-2 ? 2014 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 description of functions and examples of constant setting - continued 11. i/o condition table no. status input output v_batt scpin to vcc2 ocin lvoff inb ina out2 out1 out2 proout flt_uvlo flt_sc flt_ot osfb 1 v_batt uvlo scp uvlo h x x x x x x h z z l l l z l 2 uvlo h x x x x x x l l l z l l z l 3 v_batt uvlo ot uvlo l l x l h x x h t z z l z l l 4 uvlo l l x l h x x l t l z l z l l 5 uvlo l l x l l x x h l z z l z l l 6 uvlo l l x l l x x l l l z l z l l 7 v_batt uvlo vcc2 uvlo uvlo l h l x h x x h t z l l z z l 8 uvlo l h l x h x x l t l z l z z l 9 uvlo l h x l l x x h l z z l z z l 10 uvlo l h x l l x x l l l z l z z l 11 v_batt uvlo oc uvlo l h h h x x x h z z l l l z l 12 uvlo l h h h x x x l l l z l l z l 13 v_batt uvlo uvlo l h h l h x x h t z z l z z l 14 uvlo l h h l h x x l t l z l z z l 15 uvlo l h h l l x x h l z z l z z l 16 uvlo l h h l l x x l l l z l z z l 17 scp ot vcc2 uvlo h l l x x x x h l z l l l z l 18 h l l x x x x l l l l l l z l 19 scp ot h l h x x x x h l z l z l l z 20 h l h x x x x l l l l z l l l 21 scp vcc2 uvlo h h l x x x x h l z l l l z l 22 h h l x x x x l l l l l l z l 23 ot vcc2 uvlo l l l l h x x h t z z l z z l 24 l l l l h x x l t l z l z z l 25 l l l l l x x h l z z l z z l 26 l l l l l x x l l l z l z z l : v_batt > uvlo, x: don't care, z: hi- z, t: 2-level turn off downloaded from: http:///
26 / 37 BM60055FV-C tsz02201-0818abh00120-1-2 ? 2014 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 description of functions and examples of constant setting - continued no. status input output v_batt scpin to vcc2 ocin lvoff inb ina out2 out1 out2 proout flt_uvlo flt_sc flt_ot osfb 27 scp h h h x x x x h z z l z l z z 28 h h h x x x x l l l z z l z l 29 ot l l h l h x x h t z z z z l z 30 l l h l h x x l t l z z z l l 31 l l h l l x x h l z z z l l z 32 l l h l l x x l l l z z l l l 33 vcc2 uvlo l h l l h x x h t z z l z z l 34 l h l l h x x l t l z l z z l 35 l h l l l x x h z z z l z z l 36 l h l l l x x l l l z l z z l 37 oc l h h h x x x h z z l z l z z 38 l h h h x x x l l l z z l z l 39 normal l h h l h h x h t z z z z z z 40 l h h l h h x l t l z z z z l 41 l h h l l h x h l z z z z z z 42 l h h l l h x l l l z z z z l 43 l h h l h l h h h z z z z z z 44 l h h l h l h l h z z z z z l 45 l h h l l l h h h z z z z z z 46 l h h l l l h l h z z z z z l 47 l h h l h l l h t z z z z z z 48 l h h l h l l l t l z z z z l 49 l h h l l l l h l z z z z z z 50 l h h l l l l l l l z z z z l : v_batt > uvlo, x: don't care, z: hi-z, t: 2-level turn off downloaded from: http:///
27 / 37 BM60055FV-C tsz02201-0818abh00120-1-2 ? 2014 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 description of functions and examples of constant setting - continued 12. power supply startup / s hut down sequence : since the vcc2 to gnd2 pin voltage is low and the output mos does not turn on, the output pins become hi-z conditions. :since the v_batt pin voltage is low and the flt_uvlo output mos does not turn on, the output pins become hi-z conditions. figure 38 . power supply startup / shutdown sequence l h l l 0v 0v l out1 proout flt_uvlo v_batt vcc2 ina h l h l hi -z l hi -z l hi -z v uvlo2h v uvlobattl v uvlo2h v uvlobattl out2 l hi -z out1 proout v_batt vcc2 ina h hi -z hi -z l hi -z v uvlo2l v uvlobatth v uvlo2l v uvlobatth out2 hi -z 0v 0v flt_uvlo downloaded from: http:///
28 / 37 BM60055FV-C tsz02201-0818abh00120-1-2 ? 2014 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 selection of components externally connected q s r + + dac slope - + osc osc regulator uvlo_batt max.duty t imer t imer - osc rese t osc t imer q s r flt logic osfb current source - + - + t emp compensation filter - + filter 2 level t urn off contol - + - + pre driver logic - + vcc2 gnd1 flt_uvlo inb ina osfb fb comp v_batt vreg fet_g sense gnd1 v_ba tt gnd1 flt_ ot flt_ sc ecu vcc2 gnd2 out2 rtoff scpin ocin uvloin gnd2 gnd2 filter filter lvoff to tc vcc2 proout out1 rectifier / ripple f ilter rectifier / ripple f ilter snubber gnd2 gnd1 tcomp recommended rohm mcr100jzh mcr18ezp ltr50uzp recommended rohm mcr03ezp recommended rohm mcr03ezp recommended rohm mcr03ezp recommended rohm mcr100jzh ltr50uzp recommended rohm rb168m150 recommended rohm mcr03ezp mcr18ezp recommended rohm ltr18ezp recommended sumida ceeh139c ceer117 q s r + + dac slope - + osc osc regulator uvlo_batt max.duty t imer t imer - osc rese t osc t imer q s r flt logic osfb current source - + - + t emp compensation filter - + filter 2 level t urn off contol - + - + pre driver logic - + gnd1 flt_uvlo inb ina osfb comp fet_g gnd1 v_ba tt gnd1 flt_ot flt_sc ecu vcc2 gnd2 out2 rtoff scpin ocin uvloin gnd2 gnd2 filter filter lvoff to tc vcc2 proout out1 tcomp recommended rohm mcr100jzh mcr18ezp ltr50uzp recommended rohm mcr03ezp recommended rohm mcr03ezp recommended rohm mcr03ezp recommended rohm mcr100jzh ltr50uzp gnd1 gnd1 vreg sense fb v_batt figure 40. for non-using switching power supply controller figure 39. for using switching power supply controller downloaded from: http:///
29 / 37 BM60055FV-C tsz02201-0818abh00120-1-2 ? 2014 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 i/o equivalent circuit pin no. pin name input output equivalent circuit diagram pin function 2 uvloin output-side uvlo setting pin 3 ocin over current detection pin 4 scpin short circuit detection pin 5 lvoff 2-level turn off level setting pin 6 rtoff 2-level turn off time setting pin 7 tcomp temperature compensation pin tcomp vcc2 gnd2 internal power supply rtoff vcc2 gnd2 internal power supply lvoff vcc2 gnd2 internal power supply scpin vcc2 gnd2 ocin internal power supply vcc2 gnd2 internal power supply uvloin downloaded from: http:///
30 / 37 BM60055FV-C tsz02201-0818abh00120-1-2 ? 2014 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 i/o equivalent circuit - continued pin no. pin name input output equivalent circuit diagram pin function 8 to tc to gnd2 vcc2 internal power suppl y constant current output pin / sensor voltage input pin 9 tc constant current setting resistor connection pin 10 proout proout gnd2 vcc2 soft turn-off pin /gate voltage input pin 12 out1 out1 gnd2 vcc2 output pin 13 out2 out2 gnd2 vcc2 internal power suppl y output pin for miller clamp / gate voltage input pin downloaded from: http:///
31 / 37 BM60055FV-C tsz02201-0818abh00120-1-2 ? 2014 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 i/o equivalent circuit - continued pin no. pin name input output equivalent circuit diagram pin function 16 flt_uvlo flt_uvlo osfb flt_scp flt_ot gnd1 uvlo fault output pin 18 osfb output state feedback output pin 19 flt_ot ot fault output pin 20 flt_sc scp fault output pin 17 inb ina inb gnd1 v_batt inter nal power suppl y control input pin b 18 ina control input pin a 22 fb fb gnd1 v_batt internal power suppl y error amplifier inverting input pin for switching controller downloaded from: http:///
32 / 37 BM60055FV-C tsz02201-0818abh00120-1-2 ? 2014 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 i/o equivalent circuit - continued pin no. pin name input output equivalent circuit diagram pin function 23 comp comp gnd1 v_batt internal power suppl y error amplifier output pin for switching controller 25 vreg gnd1 v_batt fet_g vreg internal power suppl y power supply pin for driving mos fet of switching controller 26 fet_g mos fet control pin for switching controller 27 sense sense gnd1 v_batt internal power suppy current feedback resistor connection pin for switching controller downloaded from: http:///
33 / 37 BM60055FV-C tsz02201-0818abh00120-1-2 ? 2014 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity wh en connecting the power supply, such as mounting an external diode between the power supply and the ics power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separate ly but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may resul t in deterioration of the properties of the chip. the absolute maximum rating of the pd stated in this specification is whe n the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maxim um rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approximately obta ined. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin ma y subject the ic to stress. always discharge capacitors completely after each process or step. the ic s power supply should always be turned off completely before connecting or removing it from the test setup during the inspe ction process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. downloaded from: http:///
34 / 37 BM60055FV-C tsz02201-0818abh00120-1-2 ? 2014 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 operational notes C continued 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p s ubstrate) should be avoided. figure 42. example of monolithic ic structure 13. cer amic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
35 / 37 BM60055FV-C tsz02201-0818abh00120-1-2 ? 2014 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 ordering information b m 6 0 0 5 5 f v - c e 2 part number package fv : ssop-b28w product class c : for automotive applications packaging and forming specification e2 : embossed tape and reel (ssop-b28w) marking diagrams ssop-b28w (top view) b m 6 0 0 5 5 part number marking lot number 1pin mark downloaded from: http:///
36 / 37 BM60055FV-C tsz02201-0818abh00120-1-2 ? 2014 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 physical dimension , tape and reel information package name ssop-b28w (max 9.55 (include.burr)) downloaded from: http:///
37 / 37 BM60055FV-C tsz02201-0818abh00120-1-2 ? 2014 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 revision history date revision changes 15 .feb.2016 001 new release downloaded from: http:///
notice-paa-e rev.003 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extreme ly high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in advance. unless otherwise agreed in writin g by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific applic ations japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adeq uate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are no t designed under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or c onditions (as exemplified below), your independent verification and confirmation of product performance, reliabil ity, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7. de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts, please consult with th e rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice-paa-e rev.003 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contain ed in this document are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take p roper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label a two-dimensional barcode printed on rohm products label is f or rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any inte llectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert its intellectual property rights or other rights a gainst you or your customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in p art, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified , reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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